Curriculum Vitaes
Profile Information
- Affiliation
- Associate Professor, Faculty of Science and Technology Department of Information and Communication Sciences, Sophia University
- Degree
- 博士(工学)(慶應義塾大学)
- Researcher number
- 40784418
- J-GLOBAL ID
- 201701001496149200
- researchmap Member ID
- 7000020364
Research Interests
6Research Areas
4Research History
2-
Apr, 2019 - Mar, 2026
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2016 - Mar, 2019
Education
3Awards
10-
Aug, 2024
Papers
73-
Transactions of Japanese Society for Medical and Biological Engineering, 57(6) 215-223, 2019
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生体医工学, 57(6), 2019 Peer-reviewed
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EUROSENSORS 2018, 839-839, Dec 26, 2018 Peer-reviewed
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MICROMACHINES, 9(5), May, 2018
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IEEE SENSORS JOURNAL, 18(4) 1739-1746, Feb, 2018 Peer-reviewed
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Mechanical Engineering Journal, 5(1) 17-00383, 2018 Peer-reviewedLead author
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PROCEEDINGS OF THE 2018 CHI CONFERENCE ON HUMAN FACTORS IN COMPUTING SYSTEMS (CHI 2018), 2018
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Sensors and Actuators A: Physical, 264 260-267, Sep, 2017 Peer-reviewedLead author
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Japanese Journal of Applied Physics, 56(6S1) 06GN19-06GN19, May 31, 2017 Peer-reviewedLead author
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Transactions of The Japan Institute of Electronics Packaging, 10 E17-004, 2017 Peer-reviewedLead author
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2017 IEEE World Haptics Conference(WHC), 659-664, 2017
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UIST'17 ADJUNCT: ADJUNCT PUBLICATION OF THE 30TH ANNUAL ACM SYMPOSIUM ON USER INTERFACE SOFTWARE AND TECHNOLOGY, 31-33, 2017
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2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 1145-1148, 2016 Peer-reviewed
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2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 1165-1168, 2016 Peer-reviewed
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Journal of Micromechanics and Microengineering, 25(12) 125010-125010, Oct 27, 2015 Peer-reviewedLead author
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2015 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 405-408, 2015 Peer-reviewed
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Mechanical Engineering Journal, 1(4) FE0034-FE0034, 2014 Lead author
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HAPTICS: NEUROSCIENCE, DEVICES, MODELING, AND APPLICATIONS, 8618 544-551, 2014 Peer-reviewed
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2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 400-404, 2014 Peer-reviewed
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2012 PROCEEDINGS OF SICE ANNUAL CONFERENCE (SICE), 1337-1341, 2012
Misc.
72-
日本機械学会ロボティクス・メカトロニクス講演会講演論文集(CD-ROM), 2025 1P1-P07, 2025In this study, we propose a device that can output high-frequency signals without touching the vibration source by using sound, and to improve the problem of reduced output in the low-frequency band, which is a characteristic of a speaker, I use amplitude modulation to reproduce low-frequency waves from high-frequency waves. I conducted pressure measurements to validate the amplitude modulation. The results confirmed that the modulated waves were output correctly and that the modulation increased the output in the low frequency band.
Books and Other Publications
2Presentations
9-
香港科技大学広州・研究セミナー, Mar, 2026 Invited
Research Projects
9-
科学研究費助成事業, 日本学術振興会, Apr, 2026 - Mar, 2029
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科学研究費助成事業, 日本学術振興会, Apr, 2023 - Mar, 2026
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Grants-in-Aid for Scientific Research, Japan Society for the Promotion of Science, Apr, 2022 - Mar, 2025
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Grants-in-Aid for Scientific Research Grant-in-Aid for Scientific Research (B), Japan Society for the Promotion of Science, Apr, 2022 - Mar, 2025
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戦略的な研究開発の推進 戦略的創造研究推進事業 さきがけ, 科学技術振興機構, 2022 - 2025