Yoshihiko Imanaka

Electronic substrates mounting active and passive components are essential for increasing the performance of various electronic products. The circuit board is composed of insulating layer and conducting layer. It is regarded as the hybrid structure consisting of ceramics and metal. LTCC developed for the circuit board of high-speed computer in 1990 had excellent performance beyond HTCC previously developed. Lately, according to the demand of low-cost and miniaturization of the circuit board for mobile electronic products, the circuit boards embedding passive components have been developed actively. This talk will explain the aerosol deposition: key technology for the future embedded circuit board and LTCC technology.

The embedded passive technology in circuit boards has been developed in various technology approaches: printed wiring board, low temperature cofired ceramics, MCM-D and so on, to achieve miniaturization, cost reduction, and higher performance in PC and RF wireless communication products. This presentation indicates that the aerosol deposition with which the ceramic film can be deposited at room temperature, is the promising technology satisfied with the requirements of the embedded passive for next generation.

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